Extreme Networks XN-FAN-001-F 

Front-to-Back Fan Module – Single Fan (VSP 7400 Series)

The Extreme NetworksN-FAN-001-F is a switch cooling module engineered to fit VSP 7400 series and compatible SLX/7520 platforms, delivering reliable thermal management via a front-to-back airflow pattern. Designed with a compact single-fan form factor, it effectively draws cool air from the front of the chassis and exhausts heat toward the rear to maintain optimal operating temperatures. This modular fan is hot-swappable and integrates seamlessly into existing switch stacks, ensuring uninterrupted uptime—especially critical in demanding data center environments.

Features

The XN-FAN-001-F is a replacement or upgrade fan tray intended for Extreme's high-performance switching platforms, particularly the VSP 7400 series. Its front-to-back airflow design aligns with the chassis' cooling architecture, ensuring efficient ventilation and heat dissipation—ideal when nascent conditions threaten thermal thresholds This single Fan Moduleis compatible with a broad range of Extreme switch models, including VSP 7400, SLX, and 7520 series, offering simplified inventory management and replacement strategies . Weighing just 0.14 kg (0.31 lb), with dimensions of approximately 4.0 cm × 4.0 cm × 13.4 cm (1.57" × 1.57" × 5.28"), it is compact yet engineered for reliable airflow and minimal acoustic disruption 

Advanced Options

Installation is straightforward—insert it into the designated fan bay, and it becomes operational immediately, managed by the switch firmware to maintain cooling redundancy and status monitoring . Available in both new and refurbished conditions, it provides flexibility in budgeting for both routine maintenance and emergency replacementsExtreme NetworksXN-FAN-001-F provides dependable thermal management for mission-critical switching environments. Its precisely engineered front-to-back airflow maintains consistent airflow through the switch chassis, critical to sustaining performance levels under heavy load and high environmental temperatures. The module’s compact yet robust design ensures minimum space utilization while providing effective cooling.