Intel E830CQDA2OC3M Ethernet Network Adapter

Overview :

The Intel E830CQDA2OC3M is a dual-port 200GbE network interface card built on the Open Compute Project (OCP) 3.0 Small Form Factor (SFF) specification. Engineered for scalable hyperscale data centers, cloud providers, and enterprise virtualization layers, this adapter delivers high-density connectivity to maximize network infrastructure investment. It resolves critical space-constrained and power-density challenges inherent to modern multi-tenant server environments.

Operating on a PCIe 5.0 x8 or PCIe 4.0 x16 host bus interface, the card processes high-bandwidth transfers with optimized energy usage, consuming as little as 11.6 watts under direct-attach copper (DAC) traffic configurations. Network operations benefit from native Data Plane Development Kit (DPDK) and Open vSwitch (OVS) hardware acceleration, which streamline infrastructure operations by moving processing workloads directly onto the Intel E830 controller. Additionally, support for IEEE 1588 Precision Time Protocol (PTP) v2 provides sub-microsecond synchronization needed for telecommunications and precision network monitoring.

This adapter utilizes specialized OCP 3.0 mezzanine form-factor rails, ensuring toolless deployment, maintenance, and replacement within compatible open-architecture server chassis. System administrators are provided with robust firmware defense parameters through secure boot mechanics, signed firmware validation, and hardware-level Root of Trust (RoT) enforcement matching FIPS 140-3 Level 3 frameworks. Do not deploy this adapter in traditional standalone server expansion slots that rely exclusively on standard vertical low-profile or full-height PCIe bracket designs.

Key Features :

• Dual-port OCP 3.0 configuration scales network speeds up to 200Gbps.

• PCIe 5.0 x8 infrastructure doubles bandwidth for host communication lanes.

• Dynamic Device Personalization offloads packet handling from host CPUs.

• Integrated security framework includes FIPS 140-3 validation parameters.

• Low-power profile architecture reduces overall thermal load on racks.

Specifications :